Authors
|
Pisanova, E. ; Mäder, E.
|
Title
|
Acid-base interactions and covalent bonding at a fiber-matrix interface: contribution to the work of adhesion and measured adhesion strength
|
Date
|
27.01.2000
|
Number
|
6254
|
Abstract
|
The work of adhesion, <I>W</I><SUB>A</SUB>, and the practical adhesion in terms of the interfacial shear strength, τ, in some polymer-fiber systems were determined to establish a correlation between these quantities. An attempt was made to analyze the contributions of various interfacial interactions (van der Waals forces, acid-base interaction, covalent bonding) to the 'fundamental' and 'practical' adhesion. The surface free energies of the fibers were altered using different coupling agents. To characterize the strength of an adhesion contact, the ultimate adhesion strength, τ<SUB>ult</SUB>, was determined for the onset of contact failure. The adhesion of non-polar polymers occurs through van der Waals interaction only; therefore, fiber sizing does not affect the adhesion strength. For polar polymers, such as poly(acrylonitrile butadiene styrene) and polystyrene, adhesion is sensitive to fiber treatments: suppression of the acid-base interaction by using an electron-donor sizing agent γ-aminopropyltriethoxysilane results in a decrease of both 'fundamental' and 'practical' adhesion. In the case of epoxy resins, the main contribution to the work of adhesion is made by covalent bonds. Since the process of their formation is irreversible, the work of adhesion determined from micromechanical tests seems to be more reliable than indirect estimations, such as from wetting and inverse gas chromatography techniques. Fiber treatment by sizing agents results in considerable changes in the intensity of adhesional interaction with the epoxy matrix. A correlation between the work of adhesion, the ultimate interfacial shear strength, and the strength of macro-composites has been found.
|
Publisher
|
Journal of Adhesion Science and Technology
|
Wikidata
|
|
Citation
|
Journal of Adhesion Science and Technology 14 (2000) 415-436
|
DOI
|
https://doi.org/10.1163/156856100742681
|
Tags
|
|