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Authors Drechsler, A. ; Petong, N. ; Bellmann, C. ; Busch, P. ; Stamm, M. ; Grundke, K. ; Reichelt, J.
Title The Effect of Adsorbed Cationic Surfactant on the Pattern Collapse of Photoresist Lines in Photolithographic Processes
Date 30.03.2006
Number 13246
Abstract A crucial problem in the manufacturing of high aspect ratio structures in the microchip production is the collapse of photoresist patterns caused by unbalanced capillary forces. A new concept to reduce the pattern collapse bases on the reduction of the capillary forces by adsorption of a cationic surfactant. The application of a cationic surfactant rinse step in the photolithographic process leads to a reduction of the pattern collapse. Physico-chemical investigations elucidate the mechanism of surfactant adsorption and its effect on the surface properties of the photoresist. It is shown that the best pattern collapse reduction is obtained at a surfactant concentration referring to monolayer coverage. In this concentration range the capillary forces are minimized due to a hydrophobizing of the processed photoresist by adsorbed cationic surfactant.
Publisher Progress in Colloid and Polymer Science
Wikidata
Citation Progress in Colloid and Polymer Science 132 (2006) S 82-94
DOI https://doi.org/10.1007/2882_029
Tags adsorption - capillary forces - cationic surfactant - hydrophobizing - pattern collapse

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