Authors
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Drechsler, A. ; Petong, N. ; Bellmann, C. ; Busch, P. ; Stamm, M. ; Grundke, K. ; Reichelt, J.
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Title
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The Effect of Adsorbed Cationic Surfactant on the Pattern Collapse of Photoresist Lines in Photolithographic Processes
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Date
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30.03.2006
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Number
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13246
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Abstract
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A crucial problem in the manufacturing of high aspect ratio structures in the microchip production is the collapse of photoresist patterns caused by unbalanced capillary forces. A new concept to reduce the pattern collapse bases on the reduction of the capillary forces by adsorption of a cationic surfactant. The application of a cationic surfactant rinse step in the photolithographic process leads to a reduction of the pattern collapse. Physico-chemical investigations elucidate the mechanism of surfactant adsorption and its effect on the surface properties of the photoresist. It is shown that the best pattern collapse reduction is obtained at a surfactant concentration referring to monolayer coverage. In this concentration range the capillary forces are minimized due to a hydrophobizing of the processed photoresist by adsorbed cationic surfactant.
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Publisher
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Progress in Colloid and Polymer Science
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Wikidata
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Citation
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Progress in Colloid and Polymer Science 132 (2006) S 82-94
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DOI
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https://doi.org/10.1007/2882_029
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Tags
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adsorption - capillary forces - cationic surfactant - hydrophobizing - pattern collapse
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