Publications
Authors | Windrich, F. ; Malanin, M. ; Eichhorn, K.-J. ; Voit, B. ; Lang, K. D. |
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Title | Low-temperature photosensitive polyimide processing for use in 3D integration technologies |
Date | 14.10.2014 |
Number | 44443 |
Abstract | No abstract. |
Publisher | Materials Research Society symposium proceedings |
Wikidata | |
Citation | Materials Research Society symposium proceedings 1692 (2014) Abs. 520 |
DOI | https://doi.org/10.1557/opl.2014.520 |
Tags | polymer kinetics microelectronics |