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Equipment

Contact Angle Measuring

Contact Angle Measuring Equipment OCA 40 Micro
(Dataphysics, Filderstadt, Germany)

Fully automated measuring instru­ment for the analysis of the wetting behaviour of microscopic and macroscopic structure.

  • Measuring lens with 55-fold zoom (optional 137.5-fold) and software controlled, motorized, focus and adjustment of the observation angle
  • Software controlled dosing needle/ head positioning
  • Temperature control / measurement

For further information please contact:
Alexander Münch

Ellipsometry

Ellipsometer SE 402
(Sentech Instruments GmbH, Berlin)

The ellipsometer delivers information about the surface modification (thickness) of substrates

  • red He-Ne laser with a wavelength 632.8 nm is used
  • incident angle of the laser measures at 70°
  • After the sample surface is reached, the reflected light passes through the analyzer and drops onto a photo multiplier, which operates as a detector
  • The control of the ellipsometer and the data evaluation requires special software

For further information please contact:
Alexander Münch

Null-Ellipsometer Multiscope
(Optrel, Berlin)

  • Accuracy Δ±0.005°, Ψ±0.005°
  • Information about layers growth (ex- or in-situ) and optical properties of the samples can be derived, using the ellipsometry method.
  • Surface modification
  • Swelling phenomena
  • "in situ" monitoring of adsorption processes at interfaces
  • Red He-Ne laser with a wavelenght 632.8 nm is used

Dual Rotating Compensator Ellipsometer RC2-D
(Woolam Co.)

  • wavelength 193 bis 1000 nm

For further information please contact:
Petra Uhlmann

Fluorescence Microscopy

Fluorescence Microscope Axio Imager.A1m
(Carl Zeiss Jena GmbH)

  • microscopy in reflection mode as well as standard light microscopy,
  • Mercury short arc lamp for fluorescence microscopy; Halogen lamps for light microscopy
  • SPOT Insight camera and single photon sensitive camera (CASCADE II 512) for low intensity fluorescence signals and monitoring of fast processes,
  • LTS 350 heating / freezing stage,
  • objectives: 5x, 10x Epiplan HD; 20x, 50x, 100x LD-EC Epiplan-Neofluar HD DIC

For further information please contact:
Alexander Münch

Fluorescence Microscope DMi8
(Leica Microsystems)

For further information please contact:
Julian Thiele

Optical Spectroscopy

Cary 5000 UV-Vis-NIR
(Agilent Technologies Inc.)

  • Light Source: Tungsten halogen visible and deuterium arc UV
  • Maximum Scanning Speed: UV-Vis 2,000 nm/min NIR 8,000 nm/min
  • Photometric System: Double beam
  • Spectral Bandwidth: UV-Vis 0.01 - 5.00 nm, NIR 0.04 - 20 nm
  • Wavelength 175 - 3300 nm
  • Width 1020 mm Z-height 20 mm

FT-IR Spectrometer VERTEX 70
(Bruker Corporation)

For further information please contact:
Alexander Münch

Electrochemical Analysis

Potentiostat/ Galvanostat PGSTAT 100
Metrohm Autolab

Current: Maximum output current: ± 250 mA, Range: 10 nA – 100 mA, Accuracy: ±0.2 % of current + 0.2 % of current range)
Voltage: Maximum output voltage: ± 100 V, Range: ± 10 V, Accuracy: ± 0.2 % of setting/ ± 2 mV
Size: 520 mm (L) x 400 mm (W) x 166 mm (H)

PGSTAT100 is a modular high voltage potentiostat/galvanostat, especially suited for experimetns with low conductivity. Different electrochemical techniques can be used, e.g. standard cyclic voltammetry, AC voltammetry and constant current potentiostatic stripping analysis.

For further information please contact:
Olga Grätz

Climate Chamber

Climate chamber Type WK3-1000/70
Weiss Umwelttechnik GmbH/ Simulationsanlagen Messtechnik

  • Accurate temperature  and climate conditions to regulated air flow are ensured
  • Special program/software for the analysis of the measuring data is available
  • Tele-control via Intranet or Internet is possible
  • Aditional setup for Ice-adhesion measurement (Measurement of the adhesion force of an ice droplet by  using the radial force applied by a spin coater)
  • Additional setup for Frost-formation measurement (Determination of frost layer thickness by focus point shifts)

For further information please contact:
René Winkler

     

Coating

Dip Coater

The Dip Coater is another option to dispose thin films on substrates.

  • variable dipping speed

For further information please contact:
René Winkler

Spin Coater Spin 150i

The Spin Coater is used to dispose thin films on different substrates (Si-Wafer, glass,...)

  • Programmable
  • max. 12.000 rpm

Sputter Coater SCD500

  • Sputtering of Pt, Si, Cr, W
  • Carbon Thread Evaporation
  • Plasma Etching
  • Cryo-Transfer System for Sputtering with Platinum
  • Quarz for sputtered layer thickness monitoring

For further information please contact:
Michael Göbel

Sputter Coater SCD050

  • Sputtering of gold layers

For further information please contact:
Andreas Janke

Plasma Chamber

Plasma Chamber

Oxygen plasma for hydrophilisation of surfaces.

For further information please contact:
Michael Göbel

Printer

CeraFab 7500
(Lithoz)

  • Package size: 7.6 cm x 4.3 cm x 15 cm
  • Layer thickness: 25 - 100 μm
  • Print speed: up to 100 layers per hour
  • Print resolution: 40 μm (635 dpi)

For further information please contact:
Julian Thiele